I thought that Technet subscribers would like to be notified regarding this NEMI/ITRI
forum at NEPCON.
Regards, Dave Bergman, IPC
>>> Ron Gedney <[log in to unmask]> 02/19/98 12:24PM >>>
FLIP CHIP/MICROVIA FORUM
NEMI and ITRI are sponsoring a FREE forum on Flip Chip and Microvia
technologies at NEPCON West on Tuesday, March 3, 1998 from 9:00 a.m. to
4:30 p.m. The forum will be held in the Anaheim Mariott, right next door
to the Convention center. The purpose of the forum is to provide
information on the availability of Flip Chip and Microvia board products in
North America; describe actual applications currently in design and
production; and describe manufacturing assembly experience with these
technologies. This all day program is broken into six distinct Sessions as
follows:
Introduction and Overview - Dr. I. Turlik, Motorola
Applications (Describing current applications):
Steve Joy, Intel; George Carson, Motorola; Mark Anderson, Hewlett-Packard;
Glen DeVos, Delco
Flip Chip (Availability):
Bruce Blaisdell, National Semiconductor; Bill >Beckenbaugh, Motorola; Jack
Bogdanski, Flip Chip Technologies
Microvia (infrastructure and availability):
Karen Carpenter, IBM; Happy Holden; Bruce Sorenson, HADCO; Jack Fisher,
ITRI
Assembly Process:
Mike Meehan, Delco
Manufacturing Operations:
John Yealland, Celestica
The Forum will be Chaired by Dr. I. Turlik, V.P. & Director, Motorola
Corporate Mfg. Research Center.
We encourage anyone interested in these technologies to come and attend the
Forum. Attendees will be able to come in and hear any particular talk, or a
whole session, or stay all day. More detail is posted on the NEMI web
site.
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