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February 1998

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Subject:
From:
"Robert E. Mesick" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 19 Feb 1998 08:57:09 +0000
Content-Type:
text/plain
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Date:    Wed, 18 Feb 1998 16:36:15 -0500
From:    Lou Franzini <[log in to unmask]>
Subject: <No subject given>

Hi,
        I work for a company that makes stepper machines for
microlithography in making flat panel displays.  We are thinking of
adapting this technology to be used in making printed circuit boards (esp.
for micro chip modules).  I have inquired that line resolution is much
coarser in pcb's than in flat panel displays.  However I am not very privy
to pcb microlithography and would appreciate any comments or suggestions
that would help me to decide whether I should pursue this field of
application.  I am specifically interested in the following questions: Are
there any other design standards besides IPC?  What types of substrates are
used and what companies produces them or laminate them?  How are these
substrates registered (how do you locate their position before printing)
Any additional comments on MCM interconnects (BGA's , Wire Bond, etc) that
would complicate the process.
                                        Thanks,
                                                Lou


Hi,

I worked for a company that made exposures systems for PCB's and a stepper
for hybrids and we looked at this years ago.  The problem was light
intensity.  Everyone has looked at this who does exposure systems.  The
problem is the panel size changes, the panels are not flat, and plating
resists require a lot more exposure than etch resists and better
collimation (thicker resist).

The resists need a fast, collimated exposure.  At the time we looked at it,
there was not a light source that would work.  We had made an automatic,
conveyorized, 24"x24" plasma display exposure system that was the state of
the art in it's day, but it would never punch through a laminated resist
fast enough.  The longer the exposure and or less collimination, the more
light that bounces into the ajoining resist and the less definition of the
trace after development.

Best Regards,

Robert E. Mesick
Remco Engineering
Water and Wastewater Treatment Systems
www.remco.com

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