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February 1998

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Subject:
From:
Jae-heun Joung <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 19 Feb 1998 09:04:30 +0900
Content-Type:
text/plain
Parts/Attachments:
mail.txt (29 lines)
Hello technet

Is anyone currently using the RCC(RESIN COATED COPPER FOIL) for BUILD-UP PCB.
If so; how has your company interrupted it?

* UL APPROVAL
 - MATERIALS
 - APPLICATION FOR CELLUAR PHONE OR OTHER SET PRODUCT)

Where can I find inform for UL APPROVAL?

Thanks

Jae-Huen Joung

[log in to unmask]

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