It can be done either way.  Gold plating prior to HASL can be a
hassle (sorry about the pun) because the gold plated areas must be
masked off, usually with tape.  The tape can leave residues which
must then be cleaned off.  However, depending on the area to be
plated (tabs/fingers on the board edge vs. a switch pad in the middle
of the board for example), and the equipment your supplier has
available it may be the only practical method of accomplishing the
job.

Gold plating after HASL requires a method of selectively stripping
solder which can be difficult for some shops.  Especially if the gold
plating is not along the edge of the board.

There are potential quality problems with either method.  Also,
different suppliers will have different capabilities and strengths.
The appropriate process will be supplier specific.  In other words,
ya gotta let them do what they are best at!

> Date:          Tue, 3 Feb 1998 02:20:14 -0800
> From:          Ron Hayashi <[log in to unmask]>
> Subject:       <No subject given>

> applied to the boards?
> From a board manufacturing standpoint, is the gold plated to the contacts
> before or after HAL?
>
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