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February 1998

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Tue, 17 Feb 1998 08:23:04 -0800
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Chris, 

My name is Brian Stumm, I work for ETS (Manufacturer of Conformal Coating
Cure Ovens) and I have recently been working on a R&D project pertaining to
our existing oven line and the need to use humidity while curing. I have
heard it all! I can't promise that any of these work but thought I would
share anyway.

One person told me they tried first to use a store bought humidifier then
switched to a tray of water in the oven, she went on to say the abandoned
both because they were too troublesome. 

Most others told me they used either cooler cure temps or added a tray of
water in the oven next below the edge conveyor to add the humidity. As far
as I can tell you will require approx. 12-15 min cure (depends on RH of room
and time between being coated and entering the oven and also how tack free
you wish) at 120 C. I have heard people talk of a 150 C cure for the 10
minutes but not many people try these faster cures as the higher temps seem
to cause spattering and other problems. 

Sincerely,

Brian


>     All,
>       We are currently using a Dow Corning 3-1765 silicone coating in a 
>     PVA machine.  The problem lies in a execrated cure time for this 
>     material.  I am seeking information on a profile that will work with 
>     the curing process.  I have been told that without adding humidity to 
>     the process you can't go over 65ºC or you boil out the moisture it 
>     needs to fully cure.  However, I was also told that 150ºC for ten 
>     minutes w/out humidity is the proper cure.  I have a Vitronics IR 
>     reflow oven that I've been trying to get to cure this coating.  I know 
>     its not the best situation, but it was meant to be crutch until we 
>     could obtain new equipment.  This new equipment, a dip tank is 
>     intended to run Dow Corning 2577 and I also need cure profiles for it. 
>     If anyone has cure information on either the 3-1765 or the 2577 I 
>     would greatly appreciate it.
>     
>     Thanks
>     Chris Smith   M.E.
>
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