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February 1998

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Subject:
From:
Jerry Cupples <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Feb 1998 10:02:00 -0600
Content-Type:
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Chris Smith said:

>     My company is contemplating switching to the sls65 flux for our wave
>     solder processes.  We are currently using Alpha Metals NR210X no
>     clean, but are not completely satisfied with the results.  A year or
>     so ago (before I came on)the company ran a 55 gallon drum of SLS65
>     flux through one of our solder waves.  From what I've heard and read
>     it was a tremendous success with eliminating solder defects (mainly
>     solder balls).  However, I myself have no history with this flux and
>     was hoping that some of you who do can give your input.  Please let me
>     know what you think.
>
>     Thanks
>     Chris Smith  M.E.

We are evaluating the Alpha (Lonco) SLS 65 and SLS 26 F. These are similar
J-STD-004 ORM0 low solids products, designed for no-clean processing. Alpha
literature states that SLS 65 was developed "to eliminate the tendency for
solder balling and solder bridging". IMO, it has some carrier properties
which help to "survive" a chip wave, and to reduce the bridging tendencies
in a dual wave setup, especially.

We liked the soldering results. The residue is sort of "oily" in nature,
and will be mobile when handling boards. This was applied with a foam
fluxer here, and probably would give better results if sprayed. The similar
SLS26F seems to exhibit a bit less of this survival, and perhaps you could
look at this. Datasheets I have indicate both SLS 65 and SLS 26 F pass the
Bellcore SIR and EMR requirements.

Alpha also has an NR310H "VOC-free" (ORM0) which they claim will improve
soldering bridges. It does not pass the Bellcore SIR requirement. We have
not tested this product yet.

I suggest you contact Jim Norris at Lonco - Bensenville, IL at 630-766-5902
for further details.


regards,


Jerry Cupples
Interphase Corporation
Dallas, TX USA
http://www.iphase.com

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