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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 17 Feb 1998 10:02:00 -0600 |
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Chris Smith said:
> My company is contemplating switching to the sls65 flux for our wave
> solder processes. We are currently using Alpha Metals NR210X no
> clean, but are not completely satisfied with the results. A year or
> so ago (before I came on)the company ran a 55 gallon drum of SLS65
> flux through one of our solder waves. From what I've heard and read
> it was a tremendous success with eliminating solder defects (mainly
> solder balls). However, I myself have no history with this flux and
> was hoping that some of you who do can give your input. Please let me
> know what you think.
>
> Thanks
> Chris Smith M.E.
We are evaluating the Alpha (Lonco) SLS 65 and SLS 26 F. These are similar
J-STD-004 ORM0 low solids products, designed for no-clean processing. Alpha
literature states that SLS 65 was developed "to eliminate the tendency for
solder balling and solder bridging". IMO, it has some carrier properties
which help to "survive" a chip wave, and to reduce the bridging tendencies
in a dual wave setup, especially.
We liked the soldering results. The residue is sort of "oily" in nature,
and will be mobile when handling boards. This was applied with a foam
fluxer here, and probably would give better results if sprayed. The similar
SLS26F seems to exhibit a bit less of this survival, and perhaps you could
look at this. Datasheets I have indicate both SLS 65 and SLS 26 F pass the
Bellcore SIR and EMR requirements.
Alpha also has an NR310H "VOC-free" (ORM0) which they claim will improve
soldering bridges. It does not pass the Bellcore SIR requirement. We have
not tested this product yet.
I suggest you contact Jim Norris at Lonco - Bensenville, IL at 630-766-5902
for further details.
regards,
Jerry Cupples
Interphase Corporation
Dallas, TX USA
http://www.iphase.com
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