We assemble SMT boards using Fuji Equipment.

We are told the spec for allowable warp and twist of pwbs is .010"/inch.
The majority of the time the boards we receive are flat and no problem.

If we do receive pwbs which are close to this spec we have extreme
difficulty transporting them in and out of the pick and place machines.
Also the added bounce while populating the boards results in less than
perfect placements.

This flatness/warp/twist spec may have been acceptable prior to 20mil pitch
leads, BGA's etc.

What are the current industry specifications?

Thanks in advance for the help.

Dan Shea
Sr. Manufacturing Engineer
The Foxboro Company
Tel #  508-549-2410
Fax # 508-549-4379
Email: [log in to unmask]

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