In an effort to reduce soldershorts at SOICs from occuring during our wave-
soldering process, we apply what we call "pre-wave mask", pretty typical
process, I believe.  (The SOICs are previously paste-reflowed.)  However, we
have experienced damage to the leads of the SOICs when we peel the pre-wave
mask off from the wave-soldered boards.  In order to prevent this from
occuring, we are contemplating not peeling this mask away and just leaving it
on for the life of the product.  The big question:

Is there any long-term reliability issues here?  Could the mask being a future
failure location due to contamination growth or some other reason?

(Thanks to all for any help.)

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