TECHNET Archives

February 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Lester Bennington <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 16 Feb 1998 09:06:16 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
When using a moisture curing silicone conformal coating, increasing the
temperature and/or the humidity will accelerate the cure rate.  Many people
do this.  However care must be taken to insure that the cure is not
accelerated too much or else the cure byproduct, methanol for instance,
will be generated faster than it can leave the system and voids could
result.  Also many people find it necessary to add humidity to the process
just to get it up to the recommended 50% RH level, particularly at this
time of year.  With regard to the use of CO2; there is one specific cure
chemistry, the Silylamines, that is known to be accelerated by elevated CO2
levels as well as humidity.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2