Could anyone tell me what the Class II requirement is for Micro (Chip
Scale) BGA's solder voids?

The size of the balls are .325mm +/-.025mm with a pitch of .75mm.

Also, could anyone recommend a stencil thickness for printing this, and
what mesh solder paste you would use?

Would you use round, oval , or square apperatures on your stencil?

The pads on the PCB are round, but some have say use round, some say use
oval and some say use square apperatures on the stencil.  Does it really
matter?  If so why?


Thanks in advance for your advice on these questions?

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