Our company switched from Mil-Std-2000 to the IPC-A-610 and the
J-Std-001 primarily because the Mil-Std was cancelled in June of 1995.
The notice reads: "MIL-STD-2000A, dated 14 February 1991, is hereby
canceled without replacement.  Future acquisitions shall not cite any
soldering process requirements."

We felt that our customers (mostly aerospace with about 30% military)
wouldn't feel very comfortable with nothing, so we went with the
IPC/J-STD combination.  As far as which one to use: the J-STD-001 is
esentially a process specification telling you how to "build" a product,
and the IPC-A-610 is a Workmanship standard telling you the
accept/reject criteria for the product you just built.  The forward to
IPC-A-610 states: "J-STD-001 establishes the minimum acceptability
requirements for printed board assemblies soldering. THis document,
IPC-A-610, when addressing soldering is a companion and complimentary
document, providing pictorial interpretation of the requirements of
J-sTD-001.  The IPC-A-610 has additional criteria defining handling,
mechanical requirments and other workmanship requirements."

As far as CCA assembly and soldering goes the requirements in the two
document should match.

Mary Muller
Materials and Processes
ELDEC Corp.

> ----------
> From:         [log in to unmask][SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Thursday, February 12, 1998 9:22 AM
> To:   [log in to unmask]
> Subject:      [TN] IPC-610
>
> Techneters
> I am very interested in your opinion about reasons for  switching
> workmanship
> standards for military production from Mil-std-2000 to IPC 610 or
> J-std-001.
>            Thanks Gideon.
>
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