Note that there exist cost effective ED foils that perform well in low
cycle/flex to install applications.
These ED foils should not be used in High Cycle applications.

Jonathan Meigs
Oak-Mitsui
 ----------
>>>From: Shaddock, David M (CRD)
>>>To: [log in to unmask]
>>>Subject: Re: [TN] electrodep Cu foil vs. RA foil
>>>Date: Wednesday, February 11, 1998 11:11AM
>>>
>>>The Merix article submitted by Paul Formiller mentions the grain
>>>structure difference of RA vs ED foil that is important when
>>>considering flex circuits.  The vertical structure of the ED foil on a
>>>flex circuit makes it more susceptible to failure when flexed than RA,
>>>electroplated, or sputtered copper.
>>>Dave Shaddock
>>>GE
>>>> ----------
>>>> From:         Josh Moody[SMTP:[log in to unmask]]
>>>> Sent:         Monday, February 09, 1998 6:00 PM
>>>> To:   [log in to unmask]
>>>> Subject:      [TN] electrodep Cu foil vs. RA foil
>>>>
>>>> Technet,
>>>>
>>>> Can someone out there explain the difference between
>>>> rolled/annealed copper foil and electrodeposited copper
>>>> foil?  also what are the cost and availibility issues
>>>> with both, specifics are not needed only multipliers
>>>> (i.e. RA foil is half the price ED foil)
>>>>
>>>> Thanks,
>>>>
>>>>
>>>> Josh Moody
>>>> Materials Quality Engineer
>>>> Hewlett-Packard - Richardson (HPSD)
>>>> ph# (972) 497-4617
>>>> [log in to unmask]
>>>>
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