The Merix article submitted by Paul Formiller mentions the grain
structure difference of RA vs ED foil that is important when
considering flex circuits.  The vertical structure of the ED foil on a
flex circuit makes it more susceptible to failure when flexed than RA,
electroplated, or sputtered copper.
Dave Shaddock
GE
> ----------
> From:         Josh Moody[SMTP:[log in to unmask]]
> Sent:         Monday, February 09, 1998 6:00 PM
> To:   [log in to unmask]
> Subject:      [TN] electrodep Cu foil vs. RA foil
>
> Technet,
>
> Can someone out there explain the difference between
> rolled/annealed copper foil and electrodeposited copper
> foil?  also what are the cost and availibility issues
> with both, specifics are not needed only multipliers
> (i.e. RA foil is half the price ED foil)
>
> Thanks,
>
>
> Josh Moody
> Materials Quality Engineer
> Hewlett-Packard - Richardson (HPSD)
> ph# (972) 497-4617
> [log in to unmask]
>
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