You could also wave solder with selective pallets.

Bev Christian
Nortel
>----------
>From:  Phil Bavaro[SMTP:[log in to unmask]]
>Sent:  Wednesday, February 11, 1998 12:02 PM
>To:    [log in to unmask]
>Subject:       [TN] Assy: (BGAs + FPGA)/(BGAs)
>
>We have a design which is coming up that will have PBGAs (1.27 pitch) on
>both sides, and unfortunately also one fine pitch PGA on the same board.
>
>Our plan is to selectively solder the PGAs in the immediate future.  Long
>term I would like to use intrusive reflow (pin in paste, paste in hole,
>etc) to solder the PGAs.
>
>
>Has anyone done this already who is willing to share their experience?
>
>And if so, how do you guarantee that the placement operation (for us it
>will be manual) doesn't disturb the paste?
>
>One idea I thought of was to use guide pins to locate one of the PGA
>insertion/extraction tools to insert it with.  Any thoughts are welcome.
>
>
>Phillip A. Bavaro
>Senior Manufacturing Engineer
>[log in to unmask]
>Tel (619) 658-2542
>Fax (619) 658-1584
>
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