We have a design which is coming up that will have PBGAs (1.27 pitch) on
both sides, and unfortunately also one fine pitch PGA on the same board.

Our plan is to selectively solder the PGAs in the immediate future.  Long
term I would like to use intrusive reflow (pin in paste, paste in hole,
etc) to solder the PGAs.


Has anyone done this already who is willing to share their experience?

And if so, how do you guarantee that the placement operation (for us it
will be manual) doesn't disturb the paste?

One idea I thought of was to use guide pins to locate one of the PGA
insertion/extraction tools to insert it with.  Any thoughts are welcome.


Phillip A. Bavaro
Senior Manufacturing Engineer
[log in to unmask]
Tel (619) 658-2542
Fax (619) 658-1584

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