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February 1998

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Subject:
Questions Regarding Castellations on a MCM
From:
Michael Forrester <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Feb 1998 10:01:28 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines) 
My company is designing a MCM using chip on board technology.  It uses a BT
substrate and a PLCC package with castellations.  The substrate is 1 inch
square and gold plated.  We have had problems in the past with vendors
successfully manufacturing the substrate with castellations.  I have a few
questions:
     1) Is this type of package widely used today?
     2) Is there a better technology?
     3) Recommendations on a vendor that is proven to be able to handle
such a substrate.
     4) Are there any reliability issues with this type of package?
     5) Has anyone had experience attaching a MCM with castellations to an
OPC type board (Entek PLUS)?

Any comments would be greatly appreciated!  Thank you.

Best Regards,

Mike Forrester
LeCroy Corp.
[log in to unmask]

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