TECHNET Archives

February 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Stephane Richard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Feb 1998 09:29:15 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
We currently use solder paste when we do rework on PBGA's.

I m interested in knowing if it is required.  I heard that the paste was
not required for PBGA's, only for CBGA's.  Is that true ?  If so, do we
only have to put flux on the board to be rework before putting the new PBGA ?

Thank in advance.


------------------------------------------------
Stephane Richard
Ingenieur de procedes
Process Engineer
Matrox Electronic Systems Ltd
E-mail: [log in to unmask]
Telephone:(514)969-6000 ext.7585
Pagette : (514)201-0044
Fax:      (514)685-3415
-------------------------------------------------


################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2