We currently use No Clean paste for our SMT process (including BGA's). We
   have the need shortly to use a RMA based flux for some of our PCB's including
   boards with BGA 600's. In the past we have used RMA based paste for PCB SMT
   assemblies without BGA's.
     I am interested in any information or experiences that anyone might have
   using RMA flux based paste for Mounting and reflowing BGA components. Mostly
   Interested in information on Voiding, non wetting, and cleaning.

     I am especially interested in information concerning voiding of RMA vs No
   Clean for BGA's.

   Thanks,

   Mark McAuley
   Engineer
   Hitachi Computer Products

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