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February 1998

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 2 Feb 1998 22:38:44 -0000
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Joseph,

How do you propose to clean? What is the cleaning medium and temperature;
rinsing methods and, most particularly, your drying technique?

As many of the newer process materials contain surface tension reducing
agents (tensides or surfactants), the potential take-up of residues may
cause you problems.

Regards, Graham Naisbitt
__________________________________________________________________________

[log in to unmask]

Concoat Ltd
Alasan House, Albany Park
Camberley GU15 2PL UK                        http://www.concoat.co.uk

-----Original Message-----
From: Kane, Joseph <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: 02 February 1998 14:59
Subject: [TN] Moisture Sensitive Parts


>Anyone:
>
>Question on double sided SMT, RMA paste.  After side 1 reflow, we plan
>to semi-aqueous clean (followed by a short bake at 85C) before any work
>on side 2.  Will the short exposure to DI water in the rinse phase lead
>to any appreciable moisture uptake in PEM's?  Or does the mechanism
>involve longer term exposure to atmospheric moisture?  We could test
>samples, weighing before and after, but since the mix is considerable,
>advice on whether this is necessary would be welcome.
>
>Joe Kane
>Lockheed Martin Control Systems
>
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