Hi Josh,
Besides what Paul Formiller in his reply said, RA Cu foil has much more
uniform properties. ED foil, can have large variations in strength, ductility,
etch rate and electrical resistivity because of organic codeposits at the
grain boundaries. IPC-MF-150 is written loosely enough to allow most of these
variations to be shipped under the specification.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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