TECHNET Archives

February 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Josh Moody <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Feb 1998 17:00:49 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Technet,

Can someone out there explain the difference between
rolled/annealed copper foil and electrodeposited copper
foil?  also what are the cost and availibility issues
with both, specifics are not needed only multipliers
(i.e. RA foil is half the price ED foil)

Thanks,


Josh Moody
Materials Quality Engineer
Hewlett-Packard - Richardson (HPSD)
ph# (972) 497-4617
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2