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February 1998

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Subject:
From:
"Dhawan, Ashok" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 8 Feb 1998 06:59:05 -0700
Content-Type:
text/plain
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text/plain (78 lines)
In addition to ESEC , you also contact Alphasem  and Disco also based in
Switzerland. For lower end model, you may try 3P, ASM , DIAS,
Semiconductor equipment corp, . There are a couple of Japanese vendors
with highly rel machines. I do not have more details-I remember these
names--if this can help you lead..

ashok----------
> From:         Stephen R. Gregory[SMTP:[log in to unmask]]
> Sent:         February 5, 1998 10:58 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Chip On Board
>
>      Please forgive me if this appears to look like a advertisement,
> because
> it really isn't meant to be. But someone was asking all of us if we
> knew who
> he could be put in touch with regarding this technology. I'm not
> trying to be
> a salesman... honest! (but I could get a lunch outta the deal if I
> give the
> gentleman below a lead...hehehe)
>
>       You can talk to Russell Huffman at (510) 249-6700 (you will be
> put in
> touch with him or given the information so that you can talk to him),
> he's the
> sales rep for equipment from our parent company; ESEC Corporation, one
> of the
> largest vendors of semi-conductor manufacturing equipment in the
> world...they
> make wire-bonders, die-attach machines, encapsulating equipment, ect.
>
>        Our division in Switzerland of the company I am employed with
> (Zevatech
> Inc.) also makes a extremely precise bare die placement machine, the
> Micron-2.
> Granite base, ceramic air-bearing motion, etc.. As far as prices for
> this
> stuff, I'm sorry, I really don't know...Russ should be able to help
> you.
>
>                                                                 -Steve
> Gregory-
>
> Applications
> Engineer
>                                                          (See? I'm not
> a
> salesman!)
>
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