hiYa Steve,
had no probs at the last place i worked, 500 assys a month, 1 solder
failure in 4 months.. not bad!! the assy house did x-ray inspections.
remember to use the correct pad size, match it to the pad on the bga..
do not use solder mask defined pads! have you already done a
footprint?? i put vias at each pin for ict, tented on component side..
they actually changed from hasl to gold flash, flatter surfaces, even
was cheaper than hasl, easier to inspect, yadda yadda yadda.. since
i've quit there been consulting out of my house pcad ver 8.6, if you
hear of anyone needing help pass them on to me!! i also do mechanical
design, sheet metal, plastic bezels, etc.. acad ver 13
tia
Jerry Galang Independent Consultant
Simi Valley, CA
805.584.6036
Steve Schrader wrote:
>
> Does anyone have any experience with the Motorola p/n MC68EN360ZP25,
> 357 pin, 1.27mm pitch, full grid BGA package? I have heard about
> problems with reliability on the inside solder joints on the full-grid
> BGA packages...any comments? Thanks.
>
> Steve
>
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