Hello TechNetters:

I am looking for literature on the effect of overprinting solder paste
onto solder mask and its effect on solder balling. I guess the critical
parameters in this process would be

* solder particle size in the paste
* finish of the solder mask - matte/glossy, etc.
* oven profile, and
* length of overprint, and
* surface energy at the solder-solder mask interface.

I welcome all suggestions. And, thanks for your interest.

Krishna Kalyan

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