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February 1998

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Subject:
From:
Jerome Sallo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 6 Feb 1998 12:10:44 EST
Content-Type:
text/plain
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text/plain (18 lines)
Vacuum pressing can be done at lower pressure. This leads to less induced
stress and better dimensional stability. There will be less weave transfer,a
smoother copper surface and other similar benefits.
There is also a better oportunity to remove volatiles during the pressing
operation.

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