Ken
I have seen this at a previous employer.  A couple of things influenced
it:
 - as Steve has already posted to TechNet, exposure time before cure is
a factor
 - the glue cure profile was too aggressive, causing some outgassing

This resulted in voids in the glue, which picked up solder during
wavesolder (OA flux).

One way to check how your process is running is to glue an extra part on
the handling edge (if it has one) or on an unused section, cure it, and
then twist it off and have a look at the glue to see if there is any
voiding taking place.

Good Luck!

Disclaimer: opinions are my own, mileage may vary, do not try this at
home.

regards,

Graham Collins
Process Engineer,
Litton Systems Canada
(902) 873-2000 ext 215

> -----Original Message-----
> From: Ken Patel [SMTP:[log in to unmask]]
> Sent: Thursday, February 05, 1998 10:02 PM
> To:   [log in to unmask]
> Subject:      [TN] Most weird problem: Solder between epoxy & fab or
> epoxy &             comp
> Importance:   High
>
> Dear Technetters,
>
> I have seen the most weird problem in my 7 years in PCBA manufacturing
> environment. Solder is getting between the epoxy and component and/or
> between fab and epoxy thus shorting it out across terminations of SMT
> caps.
>
> Does any one has seen similar problem? Any resolution? Our regular
> process
> is epoxy application thr' stencil, component loading, curing and then
> hand
> load & wave.
>
> Any help or leads will be highly appreciated.
>
> re,
> ken patel
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 1708 McCarthy Blvd.             Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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