Hi y'all,
I need some support for the PCB laminate FAQ at:
http://www.felsweb.com/lam_faq.htm
I have following questions:
1. What is the advantage of vacuum pressing FR4?
2. What are the different applications for different Cu foil treatments?
(red treatment, brass treatment etc. - peel strength etc.)
3. What is F22? (A new CEM-1 type material - need more details)
Thank you for your support!
Jens Behrens
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