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February 1998

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Subject:
From:
Poh Kong Hui <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Feb 1998 06:32:41 +0800
Content-Type:
text/plain
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text/plain (56 lines)
Hi,

Go to the Website, www.ul.com , there should have information you are
looking for.

Hope that help..

Poh
 ===========================================================================


At 09:04 AM 2/19/98 +0900, you wrote:
>Hello technet
>
>Is anyone currently using the RCC(RESIN COATED COPPER FOIL) for BUILD-UP PCB.
>If so; how has your company interrupted it?
>
>* UL APPROVAL
> - MATERIALS
> - APPLICATION FOR CELLUAR PHONE OR OTHER SET PRODUCT)
>
>Where can I find inform for UL APPROVAL?
>
>Thanks
>
>Jae-Huen Joung
>
>[log in to unmask]
>
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