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February 1998

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TechNet <[log in to unmask]>
Date:
Mon, 2 Feb 1998 05:40:23 -0800
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"TechNet E-Mail Forum." <[log in to unmask]>, "Thomas E. Waznis" <[log in to unmask]>
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Re: Help on drying boards
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"Thomas E. Waznis" <[log in to unmask]>
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> .... in a noncontrolled environment for more than 1 year"

Three hours at 120 C is not a problem for forming a less solderable
intermetallic ( temp. is low enough) but oxidation, especially if solder
leveled boards & no clean flux, could be a problem. I would bake them flat
stacked, not racked, and check the soldering parameters on a sample board.

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