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February 1998

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Subject:
Re: NON-THERMALLY RELIEVED VIAS- ring voids
From:
Mike Bailey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 24 Feb 1998 15:41:12 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
Have you performed horizontal microsections of the affected layers to
determine if there is pinkring and/or wedgevoiding present?   Non-
relieved vias are a prime candidate (if you're going to have the problem)
and can result in circumfrential electrical opens after thermal
excursions.

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