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February 1998

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Subject:
From:
David Anderson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 19 Feb 1998 10:07:08 -0600
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I assume that you are looking for a placement machine that aligns the chip
using a split beam that looks at the bottom of the die and the board pad
simultaneously.  I'm not sure if all of these offer that feature, but you
can call them and request a literature package.

Here are a few vendors for that may be able to help:

Royce Instruments
221 Gateway Road West
Napa, CA  94558
(707) 255-9078 (p)
(707) 255-9079 (f)

Ultron Systems, Inc.
11952 Discovery Court
Moorpark, California  93021
(805) 529-1485 (p)
(805) 523-1061 (f)

Semiconductor Equipment Corporation
P.O. Box 8079
5154 Goldman Ave.
Moorpark, California 93020-8079
(805) 529-2293 (p)
(805) 529-2193 (f)

Palomar Products, Inc.
2051 Palomar Airport Road
Carlsbad, CA 92009
(619) 931-3622 (p)
(619) 931-5191 (f)

Manncorp
Box 8
1840 County Line Road
Huntingdon Valley, PA 19006
(215) 364-6100 (p)
(215) 364-6110 (f)

Dave Anderson

>>> Larry Crane <[log in to unmask]> 02/16/98 10:56am >>>
My company is looking for an inexpensive flipchip placement device for R&D
purposes only.  We are an adhesive manufacturer looking to place test
chips.  Any info would be welcome.

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