Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 2 Feb 1998 16:46:49 +0900 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hello, everyone!!
I am in trouble with "Nodules".
Please inform me about this.
1. What is the correct definition of the word, 'Nodules' , which is kind of phenomenon that
a group of small balls-like were protruded convexly on the surface of pad or bond finger
in BGA ?
2. And what kind of problem does this cause in packaging process ?
3. Also what is the spec for that 'Nodules' in judging the BGA ?
My E-mail address : [log in to unmask]
My name is Jong-Gon Kim.
Thank you very much.
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
|
|
|