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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 24 Feb 1998 18:08:45 +0900 |
Content-Type: | text/plain |
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Now we used tenting plating process for made circuit board.
In this process used for univesal MS ADDITIVE at atotech com.
Now current density 2.7A/dm2, Total ampere 1200AMP.
But when now plating, happend roughness plating, as liek residual Cu at
surface ,
It' looks like particle of Copper by burning at plating bath.
It makes a open at imaging process,
I guess it relations with air agitation, leveller, carrier concentration
of copper plating bath.
But analasys datum have no N.G .
what can I do efficience easily removes that.
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