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Wed, 4 Feb 1998 11:20:11 -0500 |
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Applied CAD Knowledge Inc |
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Blanchet,Richard wrote:
>
> Hello,
>
> As we hear more and more about BGAs, my perception is that there's some
> issues to be improved. From a military/high-end commercial application stand
> point, I have the following questions:
>
> 1- Do people put a lot of vias under BGAs to perform ICT or do they just
> perform functional tests ?
>
Our normal approach is to be using plugged/tented vias,
usually one per ball pad (full fanouts).
For ICT we add a one-sided test pad on 2ndary side as in
directly under the ball pad. Of course we prefer to dis-
tribute the testpoints across the board, but when we must
probe at the BGA package that is how we do it.
--
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800
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