IMAPS - EUROPE '99
Harrogate, Yorkshire, UK
7 - 9 June 1999
THE TECHNICAL PROGRAMME COMMITTEE WELCOMES PAPERS
ON ORIGINAL WORK AND INNOVATIVE IDEAS ESPECIALLY ON:
Markets and Roadmaps for Microelectronics, Packaging and
Interconnection
Advanced Solutions for:
. Portable, Mobile and Wireless Electronics
. Opto-microelectronics for High Speed Systems
. Automotive, Computer, Telecommunications, Space and Defence
Applications
The conference will explore the responsible role of microelectronics
and packaging as key elements of tomorrow's society. We welcome
papers describing Solutions that are in Harmony with the Environment
Plus the traditional microelectronics packaging and interconnection
fields on: . Materials . Technologies . Design . Fabrication . Process
Control . Test and Reliability
We will be pleased to receive a 500 Word Abstract describing the
novelty, purpose, method and outcome of your work. Please send your
Abstract early (deadline 7 November 1998) together with your full
name, affiliation, `phone, fax and email numbers (you may find it
convenient to use the fax-back form overleaf) to:
Prof. Nihal Sinnadurai
Technical Programme Committee,
Conference Secretariat, IMAPS - EUROPE `99
Tel: +44 1223 323437, Fax: +44 1223 460396,
email:[log in to unmask],
post: 42 Devonshire Road, Cambridge CB1 2BL, UK
______________________________________________________________________
FAX-BACK FORM
From: Name:
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Affiliation:
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Address:
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Phone: Fax: Email
______________________________________________________________
Abstract
(Title, Purpose, Novelty, Method, Outcome)
_________________________________________________________________
________________________
[log in to unmask]
Professor Nihal Sinnadurai
TWI, Cambridge, CB1 6AL, England
Tel: (+44) (0)1223 891162
Fax: (+44) (0) 1223 892588
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