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Thu, 19 Feb 1998 13:31:09 -0600 |
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We changed our process to Immersion gold and the solderability was better
than HASL and we avoided solder spots in gold fingers.
Mauricio Castro
______________________________ Reply Separator _________________________________
Subject: Re: [TN] gold over entire board
Author: Gary Griffin <[log in to unmask]> at INTERNET
Date: 2/19/98 11:07 AM
It has been my understanding that this is a normal practice and should not be a
problem. That is to say I have never had any quality issues with PCBs made this
way.
Gary
At 10:51 AM 2/19/98 -0800, you wrote:
>One of my pcb vendors (oversea) wants to fabricate boards
>using electrolytically deposited gold (1um of Au over 5um of Ni)
>over entire board surface. That includes hole walls, soldering
>pads, conductive traces and ground planes. SMOBC is out the
>window and silkscreen/LPISM are last steps in board fabration
>process.
>
>This is first time that I was informed that a board vendor
>fabricates boards by depositing gold/nickel over entire board
>surface. My questions are:
>
>What negative effects will it have for smt and th board assembly
>manufacturing?
>Are smt/th process parameters req to be readjusted such as
>reflow profile?
>Will it increase diffusion of gold in solderpot?
>Will it increase solder joint brittleness?
>Are there long-term reliability issues?
>Is there any other negative issue that need to be addressed?
>
>There's no qualm about price. It is better than SMOBC boards
>with electroless Au/Ni immersion on soldering pads.
>
>regards
>Matthew Park
>NII Norsat International Inc.
>
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==================================================
<color><param>0000,0000,ffff</param>Gary Griffin
Engineering Manager
Phone (408) 501-7156
Fax (408) 437-1976
Pager 1-800-759-7243 Pin: 145-1886
Alpha pager email griffin_p or [log in to unmask]
SABER group Interface Products</color>
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