FROM: I. MEMIS, DEPT GGMG/BLDG 257-4, AISLE A, ENDICOTT
*** Resending note of 02/09/98 11:16
      ENDICOTT ELECTRONIC PACKAGING
SUBJECT: [TN] BGA Interposer cards
 ========================================================================
At IBM, we have found that our SLC Microvia technology provides a CTE
mismatch buffer.  Some of the information has been presented at IPC
Expo '97 and SMI '97.  A recent technical paper in the December '97
issue of CircuiTree, pp. 46-54, "Assembly of Advanced Surface Laminar
Circuit(TM) PWB Substrates", by Miguel Jimarez, Ann Turner, Doug Powell,
Ash Bhatt, and Nusrat Sherali summarizes the work.  Feel free to contact
me if you want more information on this subject.
Irv Memis
IBM Microelectronic  607-755-6022
-------------------------------------------------------------------------
(Original Note)
Could any OEM's or mfg'ers share their experiences and successes using
BGA interposers to overcome CTE mismatch issues and stresses?  Details
on your implementation would be most appreciated.  Thanks in advance.
Jenni Marcy
Advisory PWB Sourcing Engineer
Storage Technology Corporation.
email     [log in to unmask]
(303)-673-4505 phone
(303)-673-4246 fax

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################