DESIGNERCOUNCIL Archives

February 1998

DesignerCouncil@IPC.ORG

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Sender:
DesignerCouncil <[log in to unmask]>
X-To:
"Taylor, Chris H." <[log in to unmask]>
Date:
Tue, 17 Feb 1998 15:36:48 -0500
Reply-To:
"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Tom Kropski <[log in to unmask]>
Subject:
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From:
Tom Kropski <[log in to unmask]>
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Chris,
Your right about the "S" not "P" but mil-s-13949 has been inactive since
Aug-01-1997.

----------
> From: Taylor, Chris H. <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [DC] FR4 Material Part Number
> Date: Tuesday, February 17, 1998 2:50 PM
>
> When did MIL-S-13949 get cancelled??? (Note: it is not MIL-P-13949
> anymore).
>
>
> Chris Taylor
> Senior Printed Circuit Designer
> LXE, Inc.
> 125 Technology Parkway
> Norcross, GA 30092
> voice: (770) 447-4224 X3242
> fax: (770) 447-6928
> e-mail: [log in to unmask]
>
>
>
> >----------
> >From:  Tom Kropski[SMTP:[log in to unmask]]
> >Sent:  Tuesday, February 17, 1998 2:20 PM
> >To:    [log in to unmask]
> >Subject:       [DC] FR4 Material Part Number
> >
> >With the cancellation of mil-p-13949, I'm wondering what part number or
> >material callout should be used when specifying GFN epoxy based board
> >material for multi-layer pcb's.
> >Like to hear from others how they specify fab material in both
commercial
> >and military documents.
> >
> >Thanks in advance,
> >Tom
> >
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