DESIGNERCOUNCIL Archives

February 1998

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
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From:
Tom Kropski <[log in to unmask]>
Date:
Tue, 17 Feb 1998 14:20:50 -0500
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Tom Kropski <[log in to unmask]>
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With the cancellation of mil-p-13949, I'm wondering what part number or
material callout should be used when specifying GFN epoxy based board
material for multi-layer pcb's.
Like to hear from others how they specify fab material in both commercial
and military documents.

Thanks in advance,
Tom

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