DESIGNERCOUNCIL Archives

February 1998

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
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From:
Leonard Toohey <[log in to unmask]>
Date:
Mon, 16 Feb 1998 16:10:39 -0600
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Leonard Toohey <[log in to unmask]>
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What is the state of the industry regarding putting
vias in the center of SMT discrete device pads?

I am mainly wanting to know about 0603, 0805 and 1206 devices.
Is board thickness a factor?
What about via hole size?


Thanks,

Leonard Toohey
[log in to unmask]
12303 Technology Blvd.
Austin, TX 78727
Ph(512) 257-5423
Fx(512) 249-7236
http://www.netspeed.com

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