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January 1998

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 2 Jan 1998 08:47:15 +1100
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Hi Werner
Could you find the cracks by interpolating the known good tolerances
program against the tested resistivity variances ?
Instead of vibrations ? The intensity required would be high ; with less
compact components (most of them comparing to BGA's) quite likely
structurally altered .
Unless prepared for destructive test .

Paul Klasek
ResMed

>----------
>From:  Engelmaier[SMTP:[log in to unmask]]
>Sent:  Thursday, January 01, 1998 9:39 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] Crack detection under BGA?
>
>Hi Kevin,
>The only way you have a chance of finding cracked solder joints in product
>with BGAs is to functionally test while subjecting your assemblies to
>vibration. This gives you a chance of finding fully fractured solder joints,
>as well as use the vibration as a screening test for latent defects. However,
>with BGAs, I am not certain that even this method is 100% effective.
>
>Werner Engelmaier
>Engelmaier Associates, L.C.
>Electronic Packaging, Interconnection and Reliability Consulting
>7 Jasmine Run
>Ormond Beach, FL  32174  USA
>Phone: 904-437-8747, Fax: 904-437-8737
>E-mail: [log in to unmask]
>
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