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January 1998

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Subject:
Re: filling the copper
From:
Steve Underwood <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 7 Jan 1998 23:58:33 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
Hello Bill,

I'm not sure what the application is, but I am wondering if you want the
epoxy from the prepreg to fill the holes.  If not, why not use no-flow
prepreg.  I don't know of a formula to determine the amount of flow;
though you might try your material supplier.

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