sam mccorkel wrote:
>
> We're experiencing a problem that could be described as similar to "dishdowns".
>
> For now we're calling them "squigglies".
>
>         The circuit has an indentation in the copper that appears to be an
> area that did not plate copper while pattern plating. The areas are small
> and have a somewhat circular shape with only the perimeter being devoid of
> plated copper. The inside of this circular area did plate while pattern
> plating. The base copper is still there.
>         The circular shape and pattern could be something that leaked out of
> the holes while they were racked at a previous process?
>
> I'm hoping someone recognizes this condition and can help us out.
>
> Thank you!
>
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> ##############################################################Sam,
Some people have termed this situation "mouse bites." Could you tell us
about your developer set-up? Breakpoint? pH of developer? Dry film
supplier and film thickness? Rinse water temp after develop?
 Also, you may be seeing a saturation of air bubbles in the plating tank,
causing these bubbles to adhere to the circuit traces and causing this
problem.If you can, turn off the filtration unit for a few hours and
allow the air bubbles to dissipate. Then try plating again, without the
filtration on and see if the problem persists.

Good Luck

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