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January 1998

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Subject:
From:
MICHAEL DODSON <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 7 Jan 1998 10:03:44 +0000
Content-Type:
text/plain
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text/plain (34 lines)
Hello,

My name is Myke Dodson and I would like
to request feedback from individuals that have experience in dealing
with "Cracked Vias" due to Z-axis expansion.

My scenario deals with an .093" board with vias drilled at .0145".
Standard FR4 material. There is sufficient copper in the hole (.001")
and there are not multiple vias that are cracking. ( i.e. 2 brds
out of 100 ).

Will higher temp material help ?
Will baking prior to assembly help ?
What is your experience with boards that have cracked vias ?
Possible solutions or suggestions.

Please send all responses to: [log in to unmask]
Phone: 408-978-8992 ext.266

Thank you,
Myke Dodson

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