Bev:
  Could you please elaoborate on what you mean by the Total pad mating
area ? Is it the footprint surface area of the component leads or is it
the total board pad surface area ?

Regards
Krishna

>Joe Belmonte and Phil Zarrow give a formula for determining the
>maximum weight of a secondary side SMT component in an article in
>Circuits Assembly, September 1996.  The formula is: Weight of
>component in grams/Total pad mating area in square inches must be >less
than 30. Perhaps your part is too heavy?  Or is this a component >that
you have been soldering successfully for some time, but can't do >now?
Has your process changed (higher temperature, less surface >tension),
higher air flow in oven, conveyor shudder?  Good luck.
>
>Bev Christian
>Nortel



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