TECHNET Archives

January 1998

TechNet@IPC.ORG

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Subject:
From:
Aric J Parr <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 7 Jan 1998 10:42:07 -0500
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      Gold PCB in the wave needs higher preheat than HASL for via and through
hole filling on some soldering machines. On other equipment, no changes are
required for complete filling. I won't state brands on Technet to avoid
advertising.

        Contact me off line if this is the problem you've encountered.

Aric Parr

______________________________ Reply Separator _________________________________
Subject: [TN] Gold Plating and solderability ?
Author:  JB <[log in to unmask]> at INTERNET


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