Hi Wolfgang - Karl Wengenroth presented some data concerning OSP finishes
and ICT issues at the IPC Surface Finish conference. Get a copy of his
paper:

"OSP Technologies: Meeting PWB Assembly Requirements", page 103-113, IPC
Summit On PWB Surface Finishes and Solderability Conference Proceedings,
September 1997.

Karl presented some data on three different probe configurations (bullet,
crown, chisel) and the information may be of help. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





[log in to unmask] on 01/06/98 04:02:54 PM

Please respond to [log in to unmask]; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] Entek boards / In Circuit Testing problems




One of my customers is experiencing contacting problems at ICT on Entek
finished boards. How can I help my customer with this ? I have heard
about "Twister" testpins, increasing contacting force, tightly
controlling initial thickness of the coating itself etc.
What is your experience, What works in real life ?
Thanks in advance / [log in to unmask]
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