Wolfgang Erat said:

>One of my customers is experiencing contacting problems at ICT on Entek
>finished boards. How can I help my customer with this ? I have heard
>about "Twister" testpins, increasing contacting force, tightly
>controlling initial thickness of the coating itself etc.
>What is your experience, What works in real life ?

I recommend that you print solder paste on the test points so that it will
reflow and leave a tin-lead surface. You can use a "spearpoint" test pin
which has a higher normal force to break the organometallic coating, but it
seems to me that modifying your stencil is a fairly inexpensive and
effective way to deal with this.

By design, most test points are clear and will take paste & reflow on top,
or wave solder automatically if that's your process.

I consider my life to be real. Maybe not - i.e., you are all just actors in
the ongoing tragi-comedy drama. If this is fiction, thanks for all the
effort out there, and your question is moot.


regards,


Jerry Cupples
Interphase Corporation
Dallas, TX USA
http://www.iphase.com/

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