TECHNET Archives

January 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet Mail Forum.
Date:
Tue, 6 Jan 1998 14:57:03 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
     Wolfgang:

     As you have found out, ENTEK is an insulator.  One of the most
     successful methods for minimizing "false fails" due to a thick ENTEK
     coating or a buildup on of ENTEK on the probes is to screen print
     paste onto the test pads at the same time as the paste for the SMT
     components.  The solder paste and flux will dissolve the ENTEK, coat
     the pad with Sn/Pb as a contact surface without sacrificing the
     flatness requirement necessary for fine-pitch IC installation onto
     your board.  Try that with a HASL board!

     Hope this helps.

     Bill Fabry
     Plantronics, Inc.
     [log in to unmask]

______________________________ Reply Separator _________________________________
Subject: [TN] Entek boards / In Circuit Testing problems
Author:  "TechNet Mail Forum." <[log in to unmask]> at INTERNET


ATOM RSS1 RSS2