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January 1998

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Subject:
Solderability During Remelt -Reply
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 6 Jan 1998 14:50:08 -0800
Content-Type:
text/plain
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text/plain (58 lines) 
Krishna,

Did you say "One" big through hole component?
Why not hand solder the Big One?  Components wandering
off from their designated spots will be a history.  If the Big
One is a connector with lots of pins, selective soldering is a
better option.

Matthew Park

>>> Krishna Kalyan <[log in to unmask]>
January 6, 1998  1:59 pm >>>
Tech Netters :
  Hello all. Thanks for all your suggestions. My problem is
not as
simple as it sounds because I have a (BIG) through hole
component that
is inserted on the top side which needs to be soldered along
with other
SMCs. So I need to have high enough a temperature on the
bottom side to
solder this BIG component while keeping my other
problem-prone SMC on
the bottom side intact !

Regards
Krishna Kalyan

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